Internship Journal for Laser?Technology Major
Internship Period: XX?XX?XXXX — XX?XX?XXXX
Internship Site: Production?Training Workshop and Technical R&D Department of XX Laser Technology Co., Ltd.
Internship Position: Practical?Trainee for Laser Processes
Internship Purpose
This professional internship focused on laser?technology aims to integrate theoretical knowledge acquired at university, including laser principles, optoelectronic technology and material?processing techniques, with real?world industrial production, equipment operation and process?parameter adjustment in enterprises. I intended to get familiar with structural principles, operating specifications and maintenance approaches of various laser?processing equipment, master core workflows of mainstream processes such as laser cutting, laser marking and laser welding, and learn about industrial?laser applications in precision manufacturing, hardware processing and electronic?component production. Meanwhile, I accumulated hands?on front?line experience, cultivated rigorous industrial?production thinking, narrowed the gap between theoretical learning and practical manufacturing, improved my operational skills and troubleshooting capabilities, and laid a solid foundation for my future employment and in?depth technical research in this field.
My two?week corporate internship on laser technology has been successfully completed. Under careful guidance from factory?skilled technicians and departmental engineers, I took part in a full set of daily tasks, including equipment operation, process?parameter tuning, workpiece quality inspection and routine equipment maintenance in the workshop. Starting as a novice unfamiliar with industrial laser?processing equipment, I gradually became competent in basic?processing operations independently and assisted technicians to optimize process parameters. I systematically learned practical?application logic and production?standard requirements for industrial lasers and gained valuable insights. My detailed internship experience and reflections are summarized below.
At the initial stage of the internship, corporate instructors delivered pre?job safety training and theoretical review sessions for interns. Laser processing is a high?precision optoelectronic manufacturing technique with multiple potential hazards including high?voltage circuits, laser radiation and high?temperature processing, which makes safety management a top priority for workshop?based production. During training, I studied standardized safety?operation rules for laser workshops systematically, learned protection requirements for fiber lasers, CO? lasers and ultraviolet lasers, mastered proper usage of laser?safety goggles, protective baffles and smoke?exhaust dust?removal systems, and became familiar with standardized procedures for pre?start?up inspection, emergency shutdown and fault reporting. Combined with workshop?installed equipment, instructors reviewed laser?generation principles and the working mechanism of stimulated emission, as well as applicable scenarios for different laser sources. I clearly understood that fiber lasers are mainly adopted for metallic?material processing, CO? lasers fit non?metal?material machining, and ultraviolet lasers are applied to ultra?precision micro?machining. This helped me connect classroom theories with industrial?grade equipment practically and correct my previous one?sided understanding of textbook knowledge.
After finishing safety?related training, I began hands?on workshop practice focusing on three mainstream processes: laser cutting, laser marking and laser welding. In laser?cutting practice, I operated fiber?laser?cutting machines with senior technicians to process carbon?steel, stainless?steel and aluminum?alloy plates. At first, I undertook auxiliary tasks such as cleaning work?pieces, leveling work?tables, drawing?layout design and parameter?data recording. Under professional guidance, I learned to use CAD and LaserCut software for drafting processing drawings and optimized layout schemes based on workpiece dimensions and plate thickness to reduce material waste. I focused on learning adjustment logic of cutting?process parameters and realized that laser power, cutting speed, focal?point position and gas?pressure value are four decisive factors for cutting?surface quality. For instance, higher laser?power output paired with slower cutting speed is required for thick carbon?steel sheets to achieve complete penetration; thin stainless?steel plates need lower laser?power settings and faster cutting speed to avoid edge burning and plate deformation. After repeated practice, I was able to independently finish layout design, parameter configuration and machine?driven cutting for simple metal sheets. Besides, I could identify common cutting defects such as dross adhesion, uneven kerf width and plate over?burning, and assist technicians to adjust process?parameters for better processing outcomes.
Laser marking was the most?frequently practiced and most?skilled?to?master technique throughout my internship, widely used for identification processing of hardware accessories, electronic components, nameplates and ornaments. The workshop was equipped with fiber?laser markers and ultraviolet?laser markers. Fiber?laser markers are used for deep?engraving patterns on metallic materials, while ultraviolet?laser markers achieve residue?free precise marking
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